iPhone 18 Pro A20 chip rumored to get radical redesign, 2nm fab process
The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging technique, on TSMC's 2nm chip fabrication technology.
Dies on wafers - Image Credit: TSMC
Rumors about the iPhone 18 generation are already spreading, even though we have yet to see the iPhone 17 range. However, the future model could be packing some design changes involving packaging.
According to GF Securities analyst Jeff Pu, Apple should be using the A20 chip for the release of the iPhone 18 Pro, Pro Max, and iPhone Fold. This makes sense, as the A20 is two generations away from the iPhone 16 range's A18 chip family.
Pu's commentary about the chip covers two matters. The first is that it will be using a 2-nanometer process.
The current A18 chip uses a second-generation 3-nanometer process, referred to as N3E. The upcoming A19 is anticipated to use a third-gen N3P process.
The process the A20 will reportedly use is referred to as N2, and is a first-generation process too. In theory, the die shrink could help the A20 be about 15% faster than the A19.
It should also be more efficient, using about 30% less power than its predecessor.
The use of a 2-nanometer process for the iPhone 18 isn't a new rumor, as it has already circulated for months. For example, in March, analyst Ming-Chi Kuo believed that all models of iPhone 18 will use the 2-nanometer process, while in September 2024, he thought it would be limited to only Pro models.
Package designs
A reduction in chip fab size will be beneficial, as always. However, a rumored new physical design of the chip could provide Apple with even more benefits.
In Pu's notes, he believes that Apple will use TSMC's new Wafer-Level Multi-Chip Module (WMCM). The new chip packaging process is said to put the memory straight onto the chip wafer.
This would bring the memory closer to the CPU, GPU, and Neural Engine that would use it. This would therefore increase the memory bandwidth, and performance.
Changing the packaging with shorter transits can also provide other benefits, including running the hardware cooler and with better battery life.
This too has been mentioned in the past, with one Weibo leaker offering it as an idea back in October 2024. At the time, it was also proposed that the change in packaging would allow for separate dies to fit together, enabling for various combinations of CPU and GPU to be used together, while maintaining a small package.
Pu's note doesn't necessarily contribute anything new to the rumors about the A20 chips and the iPhone 18 generation. They do, however, help make previous rumors seem more genuine.
Rumor Score: Possible
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Comments
With A20/M6 we're moving to WMCM where memory and processor are combined. WMCM should reduce heat and be very flat enabling the iPhone fold.
MacBook Pro/Air M6 should also be redesigned. For Pro with OLED and for both with user replaceable batteries.
So, I guess I agree that maybe they won't use the exact literal packaging technology on the Mac that they use on the iPhone, but I bet they use a higher performance analog of that packaging technology to support CPUs and GPUs on different dies within the same package.